Research
The Center focuses on research related to materials interfaces and interconnects. Click to view our 3D_Nanocarbon_Interconnects_3-2020.
Recent Publications
Books
C. Zhou, M. Zhang, and C.Y. Yang (eds.), Nanocarbon Electronics, Jenny Stanford Publishing (2021). This volume presents an extensive review of research on applications of carbon nanotubes and graphene in electronic devices. It provides a realistic assessment of the challenges faced by these nanocarbons in applications to electronics. The book consists of eight chapters covering topics on carbon nanotube and graphene transistors, interconnects, flexible sensors, and energy conversion/storage devices, contributed by experts in the field.
Journals
MD. S. Islam, A. A. M. Mazumder, C. Zhou, C. Stampfl, J. Park, and C. Y. Yang, “Current Prospects and Challenges in Negative-Capacitance Field-Effect Transistor,” Journal of the Electron Devices Society 11, 235-247 (2023).
Q. Wang, Y. Zheng, C. Zhou, M. Chan, and C.Y. Yang, "Low-temperature grown vertically aligned carbon nanotube array for an optimal infrared bolometer," Nanotechnology 32, 505719 (11 pp) (2021).
Y. Zheng, D. Li, Z. Amhed, J. Park, C. Zhou, and C.Y. Yang, "Carbon Nanotube-on-Graphene Heterostructures," Journal of Electronic Materials 49, 6806-6816 (2020).
W. Du, Z. Ahmed, Q. Wang, C. Yu, Z. Feng, G. Li, M. Zhang, C. Zhou, R. Senegor, and C.Y. Yang, “Structures, properties, and applications of CNT-graphene heterostructures,” 2D Materials 6, 042005 (16 pp) (2019).
C. Zhou, S. Raju, B. Li, M. Chan, Y. Chai, and C.Y. Yang, "Self-Driven Metal-Semiconductor-Metal WSe2 Photodetector with Asymmetric Contact Geometrics", Advanced Functional Materials 28, 1802954 (8 pp) (2018).
A.A. Vyas, C. Zhou, and C.Y. Yang, “On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes,” IEEE Transactions on Nanotechnology 17, 4-10 (2018).
Y. Abe, M. Suzuki, A. Vyas, and C.Y. Yang, “Conductive contact area estimation for carbon nanotube via interconnects using secondary electron imaging,” Journal of Applied Physics 123, 024507 (7 pp) (2018).
C. Zhou, R. Senegor, Z. Baron, Y. Chen, S. Raju, A.A. Vyas, M. Chan, Y. Chai, and C.Y. Yang, “ Synthesis and interface characterization of CNTs on graphene,” Nanotechnology 28, 054007 (10 pp) (2017).
A.A. Vyas, C. Zhou, P. Wang, Y. Chai, and C.Y. Yang, "Effect of Improved Contact on Reliability of Sub-60 nm Carbon Nanotube Vias", Nanotechnology 27, 375202 (11 pp) (2016)
A. Orphanou, T. Yamada, and C.Y. Yang, "Optimization of carbon nanotube ultracapacitor for cell design," Journal of Applied Physics 119, 214311 (6 pp) (2016).
A.A. Vyas, C. Zhou, P. Wilhite, P. Wang, and C.Y. Yang, "Electrical Properties of Carbon Nanotube via Interconnects for 30 nm Linewidth and Beyond", Microelectronics Reliability 61, 35-42 (2016).
S. Kureshi, D. Fabris, S. Tokairin, C.V. Cardena, and C.Y. Yang, "Diffraction model for thermoreflectance data," Applied Optics 54, 5314-5319 (2015).
C. Zhou, A.A. Vyas, P. Wilhite, P. Wang, M. Chan, and C.Y. Yang, "Resistance Determination for Sub-100 nm Carbon Nanotube Vias," IEEE Electron Device Letters 36, 71-73 (2015).
P. Wilhite, H.S. Uh, N. Kanzaki, P. Wang, A. Vyas, S. Maeda, T. Yamada, and C.Y. Yang, "Electron-beam and ion-beam-induced deposit tungsten contacts for carbon nanofiber interconnects," Nanotechnology 25, 375702 (8pp) (2014).
P. Wilhite, A.A. Vyas, Jason Tan, Jasper Tan, T. Yamada, P. Wang, J. Park, and C.Y. Yang, "Metal-nanocarbon contacts," Semiconductor Science and Technology 29, 054006 (16pp) (2014). (Invited paper in Special Issue on Nanocontacts). SST_2014_Wilhite_pub.pdf
A. Vyas, F. Madriz, N. Kanzaki, P. Wilhite, X. Sun, T. Yamada, and C.Y. Yang, "Carbon Nanofiber Interconnect RF Characteristics Improvement with Deposited Tungsten Contacts," Journal of Nanoscience and Nanotechnology 14, 2683-2686 (2014). JNN_2014_Vyas_pub.pdf
N. Kanzaki, S. Maeda, P. Wilhite, T. Yamada, T. Saito, and C.Y. Yang, “E-beam-Deposited Tungsten Contacts for Carbon Nanofiber Interconnect Test Devices,” Microscopy and Microanalysis 17 (Suppl 2), 1518-1519 (2011). Microsc&Microanal_2011_Kanzaki_pub.pdf
C. Zhou, Y. Yang, H. Cai, T.-L. Ren, M. Chan, and C.Y. Yang, "Temperature-Compensated High-Frequency Surface Acoustic Wave Device," IEEE Electron Device Letters 34, 1572-1574 (2013). EDL_2013_Zhou_pub.pdf
C. Zhou, Y. Yang, H. Jin, B. Feng, S. Dong, J. Luo, T.-L. Ren, M. Chan, and C.Y. Yang, "Surface acoustic wave resonators based on (002)AlN/Pt/diamond/silicon layered structure," Thin Solid Films 548, 425-428 (2013). TSF_2013_Zhou_pub.pdf
C.J. Zhou, Y. Yang, Y. Shu, H.L. Cai, T.L. Ren, M. Chan, J. Zhou, H. Jin, S.R. Dong, and C.Y. Yang, "Visible-light photoresponse of AlN-based film bulk acoustic wave resonator," Applied Physics Letters 102, 191914 (3 pp) (2013). APL_2013_Zhou_pub.pdf
C. Cardenas, D. Fabris, S. Tokairin, F. Madriz, and C.Y. Yang, "Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold," Journal of Heat Transfer 134, 111401 (7 pp) (2012). JHT_2012_Cardenas_pub.pdf
A. Orphanou, T. Yamada, and C.Y. Yang, "Modeling of a carbon nanotube ultracapacitor," Nanotechnology 23, 095401 (7 pp) (2012). Nanotechnology_2012_Orphanou_pub.pdf
H. Jin, J. Zhou, S.R. Dong, B. Feng, J.K. Luo, D.M. Wang, W.I. Milne, and C.Y. Yang, "Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering," Thin Solid Films 520, 4863-4870 (2012). TSF_2012_Jin_pub.pdf
H. Jin, S. Dong, M. Miao, J.J. Liou, and C.Y. Yang, "Breakdown voltage of ultrathin dielectric film subject to electrostatic discharge stress," Journal of Applied Physics 110, 054516 (1-4) (2011). JAP_2011_Jin_pub.pdf
D. Fabris, M. Rosshirt, C. Cardenas, P. Wilhite, T. Yamada, and C.Y. Yang, "Application of Carbon Nanotubes to Thermal Interface Materials," Journal of Electronic Packaging, Transactions of the ASME 133, 020902 (1-6) (2011). JEP_2011_Fabris_pub.pdf
S. Maeda, P. Wilhite, N. Kanzaki, T. Yamada, and C.Y. Yang, "Change in carbon fiber resistance from abient to vacuum," AIP Advances 1, 022102 (1-6) (2011). AIPA_2011_Maeda_pub.pdf
K. Li, R. Wu, P. Wilhite, V. Khera, S. Krishnan, X. Sun, and C.Y. Yang, "Extraction of contact resistance in carbon nanofiber via interconnects with varying lengths," Applied Physics Letters 97, 253109 (1-3) (2010). APL_2010_Li_pub.pdf
T. Yamada, H. Yabutani, T. Saito, and C.Y. Yang, "Temperature dependence of carbon nanofiber resistance," Nanotechnology 21, 265707 (5 pp) (2010). Nanotechnology_2010_Yamada_pub.pdf
F. Madriz, T. Yamada, X. Sun, J.G. Nickel, and C.Y. Yang, "Frequency-Independent RC Circuit Model for One-Dimensional Carbon Nanostructures," IEEE Electron Device Letters 31, 263-265 (2010). EDL_2010_Madriz_pub.pdf
T. Yamada, T. Saito, M. Suzuki, P. Wilhite, X. Sun, N. Akhavantafti, D. Fabris, and C.Y. Yang, "Tunneling between carbon nanofiber and gold electrodes," Journal of Applied Physics 107, 044304 (1-5) (2010). JAP_2010_Yamada_pub.pdf
X. Sun, K. Li, R. Wu, P. Wilhite, T. Saito, J. Gao, and C.Y. Yang, "The effect of catalysts and underlayer metals on the properties of PECVD-grown carbon nanostructures," Nanotechnology 21, 045201 (6pp) (2010). Nanotechnology_2010_Sun_pub.pdf
T. Yamada, F.R. Madriz, and C.Y. Yang, "Inductance in One-dimensional Nanostructures," IEEE Transactions on Electron Devices 56, 1834-1839 (2009). (Invited paper in Special Issue on Compact Interconnect Models for Giga Scale Integration). TED_2009_Yamada_inductance_pub.pdf
F. R. Madriz, J. R. Jameson, S. Krishnan, X. Sun, and C. Y. Yang, "Circuit Modeling of High-Frequency Electrical Conduction in Carbon Nanofibers," IEEE Transactions on Electron Devices 56, 1557-1561 (2009). TED_2009_Madriz_pub.pdf
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Electrothermal Analysis of Breakdown in carbon Nanofiber Interconnects," IEEE Electron Device Letters 30, 469-471 (2009). EDL_2009_Yamada_pub.pdf
W. Wu, S. Krishnan, T. Yamada, X. Sun, P. Wilhite, R. Wu, K. Li, and C.Y. Yang, "Contact resistance in carbon nanostructure via interconnects," Applied Physics Letters 94, 163113 (1-3) (2009). APL_2009_Wu_pub_pdf.
E.D. de Asis Jr., B. Nguyen-Vu, P.U. Arumugam, H. Chen, A.M. Cassell, R.J. Andrews, C.Y. Yang, and J. Li. "High efficient electrical stimulation of hippocampal slices with vertically aligned carbon nanofiber microbrush array," Biomedical Microdevices 11, 801-808 (2009). Biomed Micro_2009_deAsis_pub.pdf
M. Suzuki, Y. Ominami, T. Sekiguchi, and C.Y. Yang, "Secondary electron imaging of embedded defects in carbon nanofiber via interconnects," Applied Physics Letters 93, 263110 (1-3) (2008). APL_2008_Suzuki_pub.pdf
M. Suzuki, K. Kumagai, T. Sekiguchi, A.M. Cassell, T. Saito, and C.Y. Yang, "Secondary electron emission from freely supported nanowires," Journal of Applied Physics 104, 114306 (1-6) (2008). JAP_2008_Suzuki_pub.pdf
T. Saito, T. Yamada, D. Fabris, H. Kitsuki, P. Wilhite, M. Suzuki, and C.Y. Yang, "Improved contact for thermal and electrical transport in carbon nanofiber interconnects," Applied Physics Letters 93, 102108 (1-3) (2008). APL_2008_Saito_pub.pdf
Y. Ominami, M. Suzuki, K. Asakura, and C.Y. Yang, "Growth of Carbon Nanofibers on Nanoscale Catalyst Strips Fabricated with a Focused Ion Beam," Nanotechnology 19, 405302 (5pp) (2008). Nanotechnology_2008_Ominami_pub.pdf
H. Kitsuki, T. Yamada, D. Fabris, J. R. Jameson, P. Wilhite, M. Suzuki, and C.Y. Yang, "Length dependence of current-induced breakdown in carbon nanofiber interconnects," Applied Physics Letters 92, 173110(1-3) (2008). APL_2008_Kitsuki_Yamada_pub.pdf
Q. Ngo, T. Yamada, M. Suzuki, Y. Ominami, A. M. Cassell, J. Li, M. Meyyappan, and C.Y. Yang, "Structural and Electrical Characterization of Carbon Nanofibers for Interconnect Via Applications," IEEE Transactions on Nanotechnology 6, 688-695 (2007). TNT_2007_Ngo_pub.pdf
M. Suzuki, Q. Ngo, H. Kitsuki, K. Gleason, Y. Ominami, and C.Y. Yang, "Bright-field transmission imaging of carbon nanofibers on bulk substrate using conventional scanning electron microscopy," Journal of Vacuum Science & Technology B25, 1615-1621 (2007). JVST_2007_Suzuki_pub.pdf
M. Suzuki, H. Kitsuki, Q. Ngo, T. Yamada, K. Gleason, Y. Ominami, B. Roth, M. Betts, A.M. Cassell, and C.Y. Yang, "Image Formation Mechanisms in Scanning Electron Microscopy of Carbon Nanofibers on Substrate," Microscopy & Microanalysis 13 (Suppl 2), 580-581 CD (2007). Microsc&Mircoanal_2007_Suzuki_pub.pdf
M. Suzuki, Y. Ominami, Q. Ngo, A.M. Cassell, J. Li, and C.Y. Yang, "Current-induced breakdown of carbon nanofibers," Journal of Applied Physics 101, 114307 (1-5) (2007). JAP_2007_Suzuki_pub.pdf
M. Suzuki, T. Yamada, and C.Y. Yang, "Monte Carlo Simulation of SEM Bright-contrast Images of Suspended Carbon Nanofibers," Applied Physics Letters 90, 083111 (1-3) (2007). APL_2007_Suzuki_Yamada_pub.pdf
Q. Ngo, A.M. Cassell, V. Radmilovic, J. Li, S. Krishnan, M. Meyyappan, and C.Y. Yang, "Palladium-catalyzed formation of carbon nanofibers by plasma-enhanced chemical vapor deposition," Carbon 45, 424-428 (2007). Carbon_2007_Ngo_pub.pdf
M. Suzuki, Y. Ominami, Q. Ngo, and C. Y. Yang, T. Yamada, A.M. Cassell, and J. Li, "Bright contrast imaging of carbon nanofiber-substrate interface," Journal of Applied Physics 100, 104305 (1-5) (2006). JAP_2006_Suzuki_pub.pdf
Y. Ominami, Q. Ngo, M. Suzuki, A.J. Austin, C.Y. Yang, A.M. Cassell, and J. Li, "Interface Characteristics of Vertically Aligned Carbon Nanofibers for Interconnect Applications," Applied Physics Letters 89, 263114 (1-3) (2006). APL_2006_Ominami_pub.pdf
Y. Ominami, Q. Ngo, N.P. Kobayashi, K. Mcilwrath, K. Jarausch, A.M. Cassell, J. Li, and C.Y. Yang, "Bottom-up sample preparation technique for interfacial characterization of vertically aligned carbon nanofibers," Ultramicroscopy 106, 597-602 (2006). Ultramicroscopy_2006_Ominami_pub.pdf
Q. Ngo, A.M. Cassell, A.J. Austin, J. Li, S. Krishnan, M. Meyyappan, and C.Y. Yang, "Characteristics of Aligned Carbon Nanofibers for Interconnect Via Applications," IEEE Electron Device Letters 27, 221-224 (2006). EDL_2006_Ngo_pub.pdf
S. Yu, D.M. Petranovic, S. Krishnan, K. Lee, and C.Y. Yang, "Loop-Based Inductance Extraction and Modeling for Multiconductor On-Chip Interconnects," IEEE Transactions on Electron Devices 53, 135-145 (2006). TED_2006_Yu_pub.pdf
Y. Ominami, Q. Ngo, A.J. Austin, H. Yoong, C.Y. Yang, A.M. Cassell, B.A. Cruden, J. Li, and M. Meyyappan, "Structural Characteristics of Carbon Nanofibers for On-chip Interconnect Applications," Applied Physics Letters 87, 233105 (2005). APL_2005_Ominami_pub.pdf.
Y. Ominami, Q. Ngo, H. Yoong, A.J. Austin, A.M. Cassell, B.A. Cruden, J. Li, M. Meyyappan, and C.Y. Yang, "Study of Metal-Carbon Nanofiber Interfaces for On-chip Interconnect Applications," Microscopy and Microanalysis 11 (Suppl 2), 1964-1965 (2005). Microsc&Microanal_2005_Ominami_pub.pdf
Q. Ngo, B.A. Cruden, A.M. Cassell, G. Sims, M. Meyyappan, J. Li, and C.Y. Yang, "Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays," Nano Letters 4, 2403-2407 (2004). Nano Lett_2004_Ngo_pub.pdf
Q. Ngo, D. Petranovic, S. Krishnan, A.M. Cassell, Q. Ye, J. Li, M. Meyyappan, and C.Y. Yang, "Electron Transport through Metal-Multiwall Carbon Nanotube Interfaces," IEEE Transactions on Nanotechnology 3, 311-317 (2004). TNT_2004_Ngo_pub.pdf
S.-P. Sim, S. Krishnan, D. Petranovic, N. Arora, K. Lee, and C.Y. Yang, "A Unified RLC Model for High-Speed On-Chip Interconnects," IEEE Transactions on Electron Devices 50, 1501-1510 (2003). TED_2003_Sim_pub.pdf
S.-P. Sim, K. Lee, and C.Y. Yang, "High-Frequency On-Chip Inductance Model," IEEE Electron Device Letters 23, 740-742 (2002). EDL_2002_Sim_pub.pdf
K. Remashan, N.A. Wong, K. Chan, S.P. Sim, and C.Y. Yang, "Modeling Inversion-Layer Carrier Mobilities in All Regions of MOSFET Operation," Solid-State Electronics 46, 153-156 (2002). SSE_2002_Remashan_pub.pdf
Invited Conference Papers/Presentations
C. Y. Yang, “Nanocarbon Interconnects – From 1D to 3D,” 4th IEEE Electron Devices Technology and Manufacturing Conference (virtual format), Kuala Lumpur, Malaysia, April 6-21, 2020. (plenary presentation)
C.Y. Yang, “Nanocarbon Interconnects,” Workshop at Ambala College of Engineering & Applied Research, Ambala, Haryana, India, May 6, 2019. (invited presentation)
C. Y. Yang, “Nanocarbon Interconnects,” International Electron Devices & Materials Symposium, Keelung, Taiwan, November 14-16, 2018. (keynote presentation)
J. Park, C. Zhou, and C.Y. Yang, “Contacts with Nanocarbon Structures in Flexible Electronics,” 2018 IEEE International Flexible Electronics Technology Conference Proceedings, Ottawa, Canada, August 7-9, 2018, pp. 254-255. (invited paper)
A. Vyas, C. Zhou, P. Wilhite, P. Wang, and C.Y. Yang, “Nanocarbon Via Interconnects,” Proceedings of IEEE International Conference on Electron Devices and Solid-State Circuits, Hong Kong, August 3-5, 2016, pp. 5-12. (invited paper)
J. Park, C. Zhou, and C.Y. Yang, “Carbon-based Nanostructures for Flexible Electronics,” IEEE International Conference on Electron Devices and Solid-State Circuits, Shenzhen, China, June 6-8, 2018. (invited presentation)
C. Zhou and C.Y. Yang, “All-Carbon Interconnects,” IEEE International Conference on Electron Devices and Solid-State Circuits, Shenzhen, China, June 6-8, 2018. (invited presentation)
C.Y. Yang, “All-Carbon Interconnects – from 1D to 3D,” Carbon Nanostructures and Devices Symposium, 233rd Electrochemical Society Meeting, Seattle, May 13-17, 2018. (invited paper)
C.Y. Yang, “Nanocarbon Interconnects – from 1D to 3D,” 2017 IEEE 12th International Conference on ASIC, Guiyang, China, October 25-28, 2017. (keynote presentation)
C. Zhou and C.Y. Yang, “All-Carbon Interconnects – From 1D to 3D,” IEEE International Conference on Electron Devices and Solid-State Circuits, Hsinchu, Taiwan, October 18-20, 2017. (invited presentation)
C. Zhou, A. Vyas, and C.Y. Yang, “Reliability and Performance of Carbon Nanotube Vias,” 13th International Conference on Solid-State and Integrated Circuit Technology, Hangzhou, China, October 25-28, 2016. (invited presentation)
A. Vyas, C. Zhou, P. Wilhite, P. Wang, and C.Y. Yang, “Nanocarbon Via Interconnects,” Proceedings of IEEE International Conference on Electron Devices and Solid-State Circuits, Hong Kong, August 3-5, 2016, pp. 5-12. (invited paper)
A. Vyas, C. Zhou, P. Wilhite, M. Chan, and C.Y. Yang, “Carbon Nanotube Interconnect Vias,” International Conference on Materials for Advanced Technologies, Symposium Y: Reliability and Variability of Devices for Circuits and Systems, Singapore, June 28 - July 3, 2015. (invited presentation)
A. Vyas, C. Zhou, P. Wilhite, P. Wang, and C.Y. Yang, “Carbon Nanotube Via Interconnects for 30 nm Linewidth and Beyond,” Proceedings of the 17th Takayanagi Kenjiro Memorial Symposium, Hamamatsu, Japan, November 17-18, 2015, pp. 1-8. (plenary paper)
P. Wilhite, A.A. Vyas, and C.Y. Yang, “Metal-CNT Contacts,” Proceedings of the 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, Guilin, China, October 28-31, 2014, paper O06_01, 6pp. (invited paper)
C.Y. Yang, “Carbon Nanotube Vias for End-of-Roadmap On-chip Interconnects,” NCCAVS Plasma Applications Group Technical Symposium – Semiconductor Technology Beyond 7 nm, September 25, 2014. (invited presentation)
P. Wilhite, A.A. Vyas, and C.Y. Yang, “Metal-CNT Contacts,” Extended Abstracts of 2014 International Conference on Solid State Devices and Materials, Tsukuba, Japan, September 8-11, 2014, pp. 832-833. (invited paper)
C. Zhou, A. Vyas, P. Wang, M. Chan, and C.Y. Yang, “Fabrication and Characterization of Carbon Nanotube Interconnect Vias for Next-generation Technology Nodes,” Proceedings of IEEE International Conference on Electron Devices and Solid-State Circuits, Chengdu, China, June 18-20, 2014, 2 pp. (invited paper)
P. Wilhite and C.Y. Yang, “Metal-Carbon Nanotube Contacts,” NCCAVS Joint Users Technical Symposium on Nanomaterials for Energy, Biomedical, and Electronic Devices, San Jose, February 20, 2014. (invited presentation)
C.Y. Yang, “Transport in nanocarbon interconnects,” IEEE International Conference on Electron Devices and Solid-State Circuits, Bangkok, Thailand, December 3-5, 2012. (invited presentation)
C.Y. Yang, “High-frequency Characteristics of One-dimensional Nanostructures,” International Conference on Materials for Advanced Technologies, Symposium W – Reliability and Variability of Emerging Devices for Future Technologies and ULSI Circuits and Systems, Singapore, June 26 – July 1, 2011. (invited presentation)
C.Y. Yang, “High-Frequency Characteristics of One-Dimensional Nanostructures,” 219th Electrochemical Society Meeting, Symposium E3 – Graphene, Ge/III-V, and Emerging Materials for Post CMOS Applications, Montreal, Canada, May 2-6, 2011. (invited presentation)
F. Madriz, T. Yamada, and C.Y. Yang, “High-frequency Characteristics of One-dimensional Nanostructures,” Proceedings of The 2011 International Conference on Integrated Circuits and Devices in Vietnam, Hanoi, Vietnam, August 8-10, 2011, pp. 60-62. (invited paper)
C.Y. Yang, “Compact Circuit Modeling of RF Characteristics of 1-D Nanostructures,” 2011 International Symposium on Quality Electronic Design (ISQED), Santa Clara, California, March 14-16, 2011. (invited presentation)
X. Sun, K. Li, R. Wu, P. Wilhite, and C.Y. Yang, “Contact Resistances of Carbon Nanotubes Grown under Various Conditions,” Proceedings of 2010 IEEE Nanotechnology Materials and Devices Conference, Monterey, California, October 12-15, 2010, Paper FrP1-2.1. (invited paper)
A. Orphanou, T. Yamada, and C.Y. Yang, “Modeling Carbon Nanotube Ultracapacitor,” Proceedings of 2010 IEEE Nanotechnology Materials and Devices Conference, Monterey, California, October 12-15, 2010, Paper FrP2-2.1. (invited paper)
F.R. Madriz, T. Yamada, X. Sun, and C.Y. Yang, “Compact High-frequency Circuit Model for One-dimensional Carbon Nanostructures,” Proceedings of IEEE NANO 2010, Seoul, Korea, August 17-20, 2010, Paper TS5-In03. (invited paper)
X. Sun, C. Li, J. Gao, and C.Y. Yang, “Rational Growth of 1D Carbon Nanostructures for Via Interconnect Applications,” 217th Electrochemical Society Meeting, Symposium E5 – Thermal and Plasma CVD of Nanostructures and their Applications, Vancouver, Canada, April 26-30, 2010. (invited presentation)
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Transport Phenomena in Carbon Nanostructures," IEEE International Nanoelectronics Conference, Hong Kong, January 3-8, 2010, Paper KS420. (invited paper)
X. Sun, K. Li, W. Wu, P. Wilhite, T. Saito, and C.Y. Yang, "Contact resistances of carbon nanotube via interconnects," 2009 IEEE International Conference on Electron Devices and Solid-State Circuits, Xian, China, November 25-27, 2009, Paper 978-1-4244-4298-0/09 (5 pp). (invited paper)
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Transport in carbon nanostructures," 2009 IEEE International Integrated Reliability Workshop, S. Lake Tahoe, October 18-22, 2009. (invited presentation)
T. Yamada, T. Saito, D. Fabris, P. Wilhite, and C.Y. Yang, "Electrothermal Transport in Carbon Nanostructures," Proceedings of the ULSI Process Integration 6 Symposium, Electrochemical Society Meeting, Vienna, October 4-9, 2009; ECS Trans., vol. 25, issue 7, pp. 487-493. (invited paper)
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Electrothermal Transport in Carbon Nanofiber Interconnects," Proceeding of the 16th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 6-10, 2009, pp. 146-149. (invited paper)
X. Sun, K. Li, W. Wu, T. Saito, and C.Y. Yang, "Effect of Catalyst and Underlayer Metal on PECVD Growth of Vertically Aligned Carbon Nanotubes," Proceedings of 2009 IEEE Nanotechnology Materials and Devices Conference, Traverse City, Michigan, June 2-5, 2009, pp.1 -2. (invited paper).
T. Yamada, T. Saito, D. Fabris P. Wilhite, and C.Y. Yang, "Modeling of Electrothermal Performance for Carbon Nanofibers," 6th Taiwan/U.S. Air Force Nanoscience Workshop, San Francisco, April 20-21, 2009. (invited presentation)
D. Fabris, T. Saito, T. Yamada, X. Sun, P. Wilhite, and C.Y. Yang, "Current Capacity and Thermal Transport in Carbon Nanofiber Interconnects," Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Shenzhen, China, January 5-8, 2009, pp. 829-834. (invited paper)
C.Y. Yang, "Carbon Nanofibers for On-chip Interconnects," 2008 International Workshop on Next Generation Electronics, Tainan, Taiwan, November 20-21, 2008. (invited presentation)
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Effect of Current Stressing on Horizontal Carbon Nanofiber Interconnects," 25th International ULSI Multilevel Interconnection Conference Proceedings, Fremont, CA, October 27-30, 2008, pp 296-298. (invited paper)
H.Kitsuki, T. Saito, T. Yamada, D. Fabris, P. Wilhite, M. Suzuki, and C.Y. Yang, "Analysis of Carbon-based Interconnect Breakdown," Proceedings of the 9th International Conference on Solid-State and Integrated Circuit Technology, Beijing, October 20-23, 2008, pp. 530-533. (invited paper)
Hirohiko Kitsuki, Tsutomu Saito, Toshishige Yamada, Drazen Fabris, John R. Jameson, Patrick Wilhite, Makoto Suzuki, and Cary Y. Yang, "Current-carrying Capacity of Carbon Nanofiber Interconnects," Proceedings of the International Conference on Electronic Materials 2008, Sydney, Australia, July 28 - August 1, 2008. (invited paper)
C.Y. Yang, "Carbon Nanostructures as On-chip Interconnects," 26th IEEE VLSI Test Symposium, San Diego, April 29, 2008. (invited presentation)
C.Y. Yang, "Carbon-based Electrical Interconnect and Thermal Interface Materials," IEEE Workshop on Microelectronics and Electron Devices, Boise, April 18, 2008. (invited presentation)
C.Y. Yang, "Failure Mechanisms in Carbon Nanofiber Interconnects," IEEE EDS Mini-colloquium, Hangzhou, March 28, 2008. (invited presentation)
C.Y. Yang, "Carbon-based Electrical Interconnect and Thermal Interface Materials," 3rd Shanghai International Nanotechnology Cooperation Symposium, Shanghai, November 21-22, 2007. (keynote presentation)
C. Y. Yang, "Carbon Nanofiber Interconnects," VLSI Multilevel Interconnection State-of-the-Art Seminar, Fremont, CA, September 24, 2007. (invited presentation)
Quoc Ngo, Toshishige Yamada, Kris Gleason, Kris, Makoto Suzuki, Hirohiko Kitsuki, Alan M. Cassell, and Cary Y. Yang, "Electrothermal Transport in Carbon Nanostructures," Proceeding of the 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Bangalore, July 11-13, 2007, pp. 155 – 158. (invited paper)
Quoc Ngo, Toshishige Yamada, Kris Gleason, Alan M. Cassell, and Cary Y. Yang, "Electrothermal Modeling of Transport in Carbon Nanostructures," Proceedings of IEEE NANO 2007, Hong Kong, August 3-5, 2007. (invited paper)
E. de Asis, Q. Ngo, A. Seger, L. Wang, W.K. Wong, M.S. Isaacson, and C.Y. Yang, "Carbon-based Nanostructures as Interconnects in Electrical and Biological Systems," Proceedings of the 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Shanghai, October 23-26, 2006, pp. 326-329. (invited paper)
E. de Asis, Q. Ngo, W.K. Wong, M.S. Isaacson, and C.Y. Yang, "Carbon Nanostructures as Interconnect and Interface Materials," Proceedings of IEEE Nanotechnology Materials and Devices Conference 2006, Gyeongju, October 22-25, 2006, pp. 146-147. (invited paper)
Q. Ngo, E. de Asis, A. Seger, W.K. Wong, M.S. Isaacson, and C.Y. Yang, "Carbon Nanotube Interconnects in Electrical and Biological Systems," Proceedings of the 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 3-7, 2006, 281-285. (invited paper)
C. Y. Yang, "Nanostructures in Carbon Nanotube and Nanofiber Interconnects," Hitachi Nanotechnology Seminars, University of California, Santa Cruz (October 2005). (invited presentation)
Q. Ngo, S. Krishnan, A.M. Cassell, Y. Ominami, J. Li, M. Meyyappan, and C.Y. Yang, "Electrical Characterization of Carbon Nanofibers for On-chip Interconnect Applications," Proceedings of IEEE NANO 2005, Nagoya, July 11-15, 2005, pp. 585-588. (invited paper)